- M.2 NVMe PCIe Gen4 x4 solid state drive. Supports the latest platform AMD X570
- Excellent performance – Read speed is up to 5,000 MB/s. Enhances the speed and performance of the overall system
- Three heat dissipation elements – the combination of graphene and copper can provide excellent heat dissipation. 0.2mm ultra-thin and patented cooling module can avoid interference during installation
- Multiple protection, smart management technology – effectively monitors the status of solid state drive and maximizes its performance
The aesthetic of thinness – releasing the ultimate performance
Z440 uses the latest and fastest PCIe Gen4x4 interface and complies with the NVMe 1.3 standard. With <1mm thin of graphene copper foil, the sequential read/write speed is up to 5,000/4,400 MB/s. In addition, T-FORCE’s exclusive totem patterns let gamers enjoy the ultimate aesthetics of both outside and inside.
3D NAND + PCIe4.0 – capacity and performance progress greatly
The 3D flash memory is stacked in a three-dimensional way 1TB of large storage.
In addition, it is downward compatible with the PCIe 3.0 platform, comprehensively improving gamer’s gaming experience and satisfying the demand for various large-scale data computing tasks.
Well-proportioned – transfer heat source together
The <1mm thin graphene copper foil thermal conductive heat spreader can effectively eliminate both waste heat and device interference during installation. It can be installed on all major motherboard and M.2 slots. Even without the cooling module of the motherboard, it can still transfer heat source effectively, allowing gamers to enjoy high-speed performance.
Three heat dissipation elements – the combination of graphene and copper can provide excellent heat dissipation
After T-FORCE’s long-term and rigorous internal laboratory tests and burn-in test, the patented graphene copper foil thermal conductive material has been developed and is able to provide more than 9% of cooling effect during actual continuous reading/writing for over 3 hours. Thermal conduction (graphene), thermal radiation (graphene) and thermal capacity (copper), these three elements can perfectly showcase an excellent heat dissipation performance.
Smart management technology – trustworthy reliability
The built-in smart algorithm management mechanism has functions such as GC (garbage collection), TRIM command, LDPC (Low Density Parity Check Code) error correction mechanism, E2E Data Protection, etc. which are able to help in operation efficiency, prolong the service life of the SSD, while also allowing gamers to ensure data security, maximize its performance and the stability of data transfer.